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[link url=http://web.mit.edu target=_blank]MIT[/link] and [link url=https://www.stanford.edu target=_blank]Stanford University[/link] have spawned a [link url=https://www.nature.com/nature/journal/v547/n7661/full/nature22994.html target=_blank]ground-breaking new circuit architecture[/link]. It combines 3 functions – CPU, memory and nanosensors – in 3 vertically stacked layers. Massive amounts of data can thus be processed faster and more efficiently than in conventional silicon modules. Could this also be an ideal solution for connected vehicles?